US 12,009,572 B2
Antenna package
Romain Coffy, Voiron (FR); and Georg Kimmich, Saint-Marcellin (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR); and STMicroelectronics (Alps) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR); and STMicroelectronics (Alps) SAS, Grenoble (FR)
Filed on May 11, 2022, as Appl. No. 17/742,039.
Claims priority of application No. 2105186 (FR), filed on May 18, 2021.
Prior Publication US 2022/0376379 A1, Nov. 24, 2022
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H01Q 13/18 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 1/422 (2013.01); H01Q 13/18 (2013.01)] 43 Claims
OG exemplary drawing
 
1. A package, comprising:
an upper level including:
a stack comprising insulating layers and conductive elements;
a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; and
an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element.