US 12,009,464 B2
Display device and manufacturing method thereof
Wei-Fu Wu, Hsinchu (TW); Yu Tseng, Hsinchu (TW); Yu-Ting Liu, Hsinchu (TW); Chih-Cheng Kao, Hsinchu (TW); and Tsai-Chi Yeh, Hsinchu (TW)
Assigned to Au Optronics Corporation, Hsinchu (TW)
Filed by Au Optronics Corporation, Hsinchu (TW)
Filed on Nov. 1, 2021, as Appl. No. 17/515,558.
Claims priority of application No. 110129180 (TW), filed on Aug. 6, 2021.
Prior Publication US 2023/0050951 A1, Feb. 16, 2023
Int. Cl. H01L 33/62 (2010.01); G02F 1/1345 (2006.01); H01L 23/538 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01)
CPC H01L 33/62 (2013.01) [G02F 1/13452 (2013.01); H01L 23/5387 (2013.01); H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 2933/0066 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display device, comprising:
a pixel array substrate, having a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface, wherein a plurality of bonding pads are located on the first surface; and
a circuit board, electrically connected to the bonding pads, bent from above the first surface of the pixel array substrate to below the second surface, wherein the circuit board comprises a thermoplastic substrate, wherein the thermoplastic substrate comprises a third surface facing the pixel array substrate and a fourth surface opposite to the third surface, and the thermoplastic substrate comprises a first bend formed by thermoplastics.