US 12,009,382 B2
Imaging device and electronic device
Yoshiaki Masuda, Kanagawa (JP); and Tomohiko Asatsuma, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/420,471
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Dec. 19, 2019, PCT No. PCT/JP2019/049885
§ 371(c)(1), (2) Date Jul. 2, 2021,
PCT Pub. No. WO2020/149096, PCT Pub. Date Jul. 23, 2020.
Claims priority of application No. 2019-007249 (JP), filed on Jan. 18, 2019.
Prior Publication US 2022/0085092 A1, Mar. 17, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 31/153 (2006.01)
CPC H01L 27/14634 (2013.01) [H01L 27/1462 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/1469 (2013.01); H01L 31/153 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An imaging device comprising:
a first substrate including a first pixel array unit in which a plurality of pixels having at least a first photoelectric conversion unit that performs photoelectric conversion is arranged in a two-dimensional manner, a first wiring layer, and a first support layer stacked in this order; and
a second substrate including a second pixel array unit in which a plurality of pixels having at least a second photoelectric conversion unit that performs photoelectric conversion is arranged in a two-dimensional manner, a second wiring layer, and a second support layer stacked in this order,
wherein the first support layer and the second support layer are bonded to each other to form a stacked structure of the first substrate and the second substrate, and
at least one of the first support layer or the second support layer includes an antireflection layer.