CPC H01L 27/14618 (2013.01) [G01S 7/481 (2013.01); G01S 7/4863 (2013.01); G01S 17/02 (2013.01); H01L 27/14607 (2013.01); H01L 27/14623 (2013.01); H01S 5/183 (2013.01); H01S 5/4025 (2013.01)] | 20 Claims |
1. An optical sensing system, comprising:
an integrated transmitter module configured to emit an optical signal into an environment surrounding the optical sensing system,
wherein the integrated transmitter module comprises a laser emitter, one or more driving integrated circuits (ICs), and one or more optics integrated into a chamber that is hermetically sealed,
wherein a first set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material;
a photodetector configured to receive the optical signal reflected from the environment surrounding the optical sensing system and convert the received optical signal to an electrical signal; and
a readout circuit configured to convert the electrical signal to a digital signal,
wherein the photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.
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