US 12,009,375 B2
Imaging device and imaging element
Kazuhiro Hoshino, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/250,727
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 10, 2019, PCT No. PCT/JP2019/027354
§ 371(c)(1), (2) Date Feb. 24, 2021,
PCT Pub. No. WO2020/049867, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 2018-166339 (JP), filed on Sep. 5, 2018.
Prior Publication US 2021/0399026 A1, Dec. 23, 2021
Int. Cl. H01L 27/146 (2006.01); H04N 23/741 (2023.01)
CPC H01L 27/1461 (2013.01) [H01L 27/14607 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01); H04N 23/741 (2023.01)] 15 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
an imaging element;
an individual micro lens for each pixel that constitutes the imaging element, wherein
each pixel of the imaging element includes:
a first sensitive pixel region at a central portion of the pixel; and
a second sensitive pixel region that surrounds the high-sensitive pixel region, and
central positions of the high-sensitive pixel region and the low-sensitive pixel region coincide with each other; and
an output control unit configured to calculate a pixel value corresponding to a pixel by a combination process of outputs of photodiodes (PDs) each being set corresponding to one of a plurality of pixel regions with different sensitivities.