US 12,009,353 B2
Optical device package with compatible lid and carrier
Tsung-Yueh Tsai, Kaohsiung (TW); Meng-Jen Wang, Kaohsiung (TW); Yu-Fang Tsai, Kaohsiung (TW); and Meng-Jung Chuang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Apr. 12, 2022, as Appl. No. 17/719,280.
Application 17/719,280 is a continuation of application No. 16/664,652, filed on Oct. 25, 2019, granted, now 11,302,682.
Prior Publication US 2022/0238502 A1, Jul. 28, 2022
Int. Cl. H01L 25/16 (2023.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/165 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An optical device package, comprising:
a carrier;
an optical element disposed on an upper surface of the carrier;
a lid disposed on the upper surface of the carrier; and
an adhesive between the lid and the carrier;
wherein at least a portion of the adhesive is below the optical element;
wherein the upper surface of the carrier comprises a first portion and a second portion recessed with respect to the first portion, and wherein the adhesive is disposed on the second portion of the upper surface of the carrier.