US 12,009,343 B1
Stackable package and method
Robert Francis Darveaux, Gilbert, AZ (US); Roger D. St. Amand, Tempe, AZ (US); and Vladimir Perelman, Fremont, CA (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Nov. 9, 2016, as Appl. No. 15/347,545.
Application 15/347,545 is a continuation of application No. 13/912,540, filed on Jun. 7, 2013, granted, now 9,496,210.
Application 13/912,540 is a continuation of application No. 12/917,185, filed on Nov. 1, 2010, granted, now 8,482,134, issued on Jul. 9, 2013.
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 24/11 (2013.01); H01L 24/17 (2013.01); H01L 25/50 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06589 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic package comprising:
a substrate;
a first terminal on a first surface of the substrate;
an electronic component on the first surface of the substrate and coupled to the first terminal;
a second terminal on the first surface of the substrate;
a cylindrical interconnection structure on the first surface of the substrate and coupled to the second terminal; and
a package body on the first surface of the substrate and surrounding at least a portion of the cylindrical interconnection structure,
wherein the package body comprises a molded encapsulating material that directly contacts a plurality of lateral surfaces of the electronic component, and
wherein the cylindrical interconnection structure is laterally surrounded by the molded encapsulating material and comprises a copper column comprising:
a lower column portion that extends below a lowermost bottom surface of the molded encapsulating material, wherein no portion of the molded encapsulating material is below a lowermost side of the lower column portion; and
an upper column portion that protrudes upward from a top surface of the molded encapsulating material.