US 12,009,341 B2
Integrated antenna package structure
Po-Kai Chiu, Taoyuan (TW); Sheng-Tsai Wu, Taoyuan (TW); Yu-Min Lin, Hsinchu County (TW); Wen-Hung Liu, Taichung (TW); Ang-Ying Lin, Tainan (TW); and Chang-Sheng Chen, Taipei (TW)
Assigned to Industrial Technology Research Institute, Hsinchu (TW)
Filed by Industrial Technology Research Institute, Hsinchu (TW)
Filed on Dec. 28, 2021, as Appl. No. 17/564,197.
Claims priority of application No. 110147388 (TW), filed on Dec. 17, 2021.
Prior Publication US 2023/0197680 A1, Jun. 22, 2023
Int. Cl. H01L 31/0203 (2014.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0652 (2013.01) [H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated antenna package structure, comprising:
a first redistribution structure comprising a plurality of first conductive layers and a plurality of first insulating layers overlapping the plurality of first conductive layers;
a first chip located on a first side of the first redistribution structure and electrically connected to the first redistribution structure;
a heat dissipation structure thermally connected to the first chip, wherein the first chip is located between the heat dissipation structure and the first redistribution structure;
a second chip located on a second side of the first redistribution structure opposite to the first side and electrically connected to the first redistribution structure, wherein one of the plurality of first conductive layers is located between the first chip and the second chip; and
an antenna structure electrically connected to the first redistribution structure, wherein the antenna structure extends continuously to contact a top surface of the one of the plurality of first conductive layers.