US 12,009,336 B2
Packages with electrical fuses
Mahmud Halim Chowdhury, Richardson, TX (US); Amin Sijelmassi, Dallas, TX (US); Murali Kittappa, Plano, TX (US); Anindya Poddar, Sunnyvale, CA (US); Honglin Guo, Dallas, TX (US); Joe Adam Garcia, Royse City, TX (US); and John Paul Tellkamp, Rockwall, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jul. 30, 2021, as Appl. No. 17/390,823.
Prior Publication US 2023/0036643 A1, Feb. 2, 2023
Int. Cl. H01L 23/00 (2006.01); H01H 85/02 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/48 (2013.01) [H01H 85/0241 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01H 2085/0283 (2013.01); H01L 23/49555 (2013.01); H01L 23/49827 (2013.01); H01L 24/73 (2013.01); H01L 2224/4801 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/494 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/8534 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/2075 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A package, comprising:
a semiconductor die having a device side and a bond pad on the device side;
a conductive terminal exposed to an exterior of the package; and
an electrical fuse comprising:
a conductive ball coupled to the bond pad; and
a bond wire coupled to the conductive terminal, the bond wire stitch-bonded to the conductive ball.