US 12,009,334 B2
Insulating paste-based conductive device and manufacturing method thereof
Jianwei Chen, Shenzhen (CN)
Assigned to Shenzhen Guangshe Zhaoming Technology Co., LTD, Shenzhen (CN)
Filed by Shenzhen Guangshe Zhaoming Technology Co., LTD, Shenzhen (CN)
Filed on Apr. 15, 2022, as Appl. No. 17/721,418.
Claims priority of application No. 202210297900.1 (CN), filed on Mar. 24, 2022.
Prior Publication US 2023/0307408 A1, Sep. 28, 2023
Int. Cl. H01L 23/00 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01)
CPC H01L 24/32 (2013.01) [H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 1/144 (2013.01); H05K 3/368 (2013.01); H01L 24/05 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/05693 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/12041 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An insulating paste-based conductive device, comprising a first substrate and a second substrate arranged relative to the first substrate, and further comprising at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, wherein the insulating paste coating is electrically connected with the first electrode and the corresponding second electrode;
where, the insulating paste coating has a nanometer thickness.