US 12,009,320 B2
Interconnect loss of high density package with magnetic material
Zhiguo Qian, Chandler, AZ (US); Cemil Geyik, Gilbert, AZ (US); Jiwei Sun, Chandler, AZ (US); Gang Duan, Chandler, AZ (US); and Kemal Aygün, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 8, 2019, as Appl. No. 16/596,383.
Prior Publication US 2021/0104476 A1, Apr. 8, 2021
Int. Cl. H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A package substrate, comprising:
a first conductive layer in a first magnetic layer;
a second magnetic layer over the first magnetic layer, wherein the first and second magnetic layers include a plurality of magnetic materials;
a second conductive layer in the second magnetic layer, wherein the second conductive layer includes a plurality of first traces, and wherein the plurality of first traces are fully surrounded by the first and second magnetic layers, wherein the second conductive layer further includes a plurality of second traces, wherein the plurality of first traces are a plurality of single-ended routing traces, wherein the plurality of second traces are a plurality of differential routing traces, wherein the plurality of single-ended routing traces have a width and a line spacing that is lower than a width and a line spacing of the plurality of differential routing traces, and wherein the plurality of single-ended routing traces and the plurality of differential routing traces are fully surrounded by the plurality of magnetic materials; and
a third conductive layer over the second magnetic layer, wherein the plurality of magnetic materials include manganese (Mn) ferrite materials, zinc (Zn) and Mn (Zn/Mn) ferrite materials, or nickel (Ni) and Zn (Ni/Zn) ferrite materials.