US 12,009,314 B2
Semiconductor device and method of compartment shielding using bond wires
YoungCheol Kim, Gyeonggi-do (KR); ChoonHeung Lee, Singapore (SG); and WonGyou Kim, Gyeonggi-do (KR)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Aug. 11, 2022, as Appl. No. 17/819,271.
Application 17/819,271 is a continuation of application No. 17/032,005, filed on Sep. 25, 2020, granted, now 11,450,618.
Claims priority of provisional application 62/962,288, filed on Jan. 17, 2020.
Prior Publication US 2022/0384361 A1, Dec. 1, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4889 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a bond wire on the substrate;
disposing an electrical component over the substrate, wherein the bond wire loops over the electrical component with a distal end of the bond wire returning to contact the substrate;
depositing an encapsulant over the substrate and bond wire;
forming an opening in the encapsulant extending below a surface of the encapsulant to a mid-portion of the bond wire; and
disposing a conductive material in the opening to contact the mid-portion of the bond wire.