US 12,009,312 B2
Semiconductor device package
Chanyuan Liu, Kaohsiung (TW); Kuo-Hsien Liao, Kaohsiung (TW); and Yu-Hsiang Sun, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Sep. 23, 2021, as Appl. No. 17/483,720.
Prior Publication US 2023/0092873 A1, Mar. 23, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49811 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and
a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors,
wherein the first semiconductor component is in physical contact with the first shielding member.