US 12,009,311 B2
Circuit systems
Stephen Andrew Steger, Santa Monica, CA (US); and Emily Lauren Clopp, Santa Monica, CA (US)
Assigned to Snap Inc., Santa Monica, CA (US)
Filed by Snap Inc., Santa Monica, CA (US)
Filed on Nov. 30, 2020, as Appl. No. 17/106,907.
Application 17/106,907 is a continuation of application No. 16/903,016, filed on Jun. 16, 2020, granted, now 10,879,193.
Application 16/903,016 is a continuation of application No. 15/871,613, filed on Jan. 15, 2018, granted, now 10,714,429.
Prior Publication US 2021/0313279 A1, Oct. 7, 2021
Int. Cl. H05K 1/02 (2006.01); H01L 23/552 (2006.01); H05K 9/00 (2006.01)
CPC H01L 23/552 (2013.01) [H05K 1/0216 (2013.01); H05K 9/0081 (2013.01); H05K 9/0024 (2013.01); H05K 9/0052 (2013.01); H05K 9/0071 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/10371 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A circuit board system comprising:
a first circuit board comprising a substrate and a first component susceptible to electromagnetic interference carried by the substrate;
a flexible circuit element separate from the first circuit board; and
a dual-purpose connector-shield mounted on the first circuit board, the connector-shield comprising:
a shield formation that is configured and positioned to at least partially shield the first component from electromagnetic interference; and
a connection mechanism that is engaged with the flexible circuit element to couple the connector-shield and therefore the first circuit board to the flexible circuit element.