US 12,009,286 B2
Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages
Soon Lee Liew, Ipoh (MY); Eng Wah Woo, Ipoh (MY); and Alexander Komposch, Morgan Hill, CA (US)
Assigned to MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed by MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed on Oct. 18, 2021, as Appl. No. 17/504,284.
Prior Publication US 2023/0117260 A1, Apr. 20, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 23/3178 (2013.01); H01L 23/481 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of forming a packaged semiconductor device, comprising:
providing a leadframe blank including a first package blank, a second package blank and a tie bar between the first package blank and the second package blank, each package blank comprising a die attach pad and a lead, wherein the leads of the first and second package blanks are attached to the tie bar;
forming a recessed cavity in the tie bar; and
separating the first and second package blanks along the tie bar,
wherein each package blank comprises a plurality of leads attached to the tie bar at respective attachment points, the method further comprising forming a plurality of recessed cavities in the tie bar at the attachment points.