CPC H01L 23/427 (2013.01) [H01L 23/3735 (2013.01); H01L 25/0655 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01)] | 13 Claims |
1. A heat exchanger for thermal management of an electronic device, the heat exchanger comprising:
a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source; and
an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars, wherein each of the hollow pillars has an evaporation surface and a pore, the pore is configured to channel the continuous flow of the liquid through q respective one of the hollow pillars to the evaporation surface, the evaporation surface being configured to maintain a corresponding one of the droplets on the respective one of hollow pillars within a contact line, wherein the evaporation surface has a wetting efficiency of at least 95% and the contact line has a length of less than 0.0314 mm,
wherein the heat exchanger has a stacked configuration in which the liquid delivery laver is positioned between the evaporation laver and the electronic device.
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