CPC H01L 23/3677 (2013.01) [H01L 23/473 (2013.01)] | 9 Claims |
1. A semiconductor apparatus, comprising:
an insulated substrate having a first surface and a second surface that are opposite to each other; and
a semiconductor element that is mounted on the first surface of the insulated substrate;
a cooler for cooling the semiconductor element, the cooler including
a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate,
a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and
a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess, wherein
the recess of the cooling case has a substantially rectangular shape;
the heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case;
the plurality of engagement pieces include a pair of reference engagement pieces, which engage portions of the inner wall surface of the cooling case respectively at two corners of the substantially rectangular shape that are diagonally opposite from each other; and
in both a first view that is in a first direction in parallel to longer sides of the substantially rectangular shape, and a second view that is in a second direction in parallel to shorter side of the substantially rectangular shape, each of the reference engagement pieces is free of overlapping with any of the plurality of fins.
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