CPC H01L 22/14 (2013.01) [H01L 22/12 (2013.01); H01L 22/26 (2013.01); H10B 43/20 (2023.02); H10B 43/10 (2023.02)] | 20 Claims |
1. A method, comprising:
receiving a first plurality of an integrated circuit as first test samples, the integrated circuit comprising a plurality of circuitry layers formed on a substrate;
performing one or more first tests on the first test samples to determine a corresponding one or more metrology data values for each of the first test samples;
performing one or more second tests on the first plurality of the integrated circuit, the one or more second tests including determining values for electrical properties of a first subset of the circuitry layers;
performing a machine learning process to determine a correlation between the metrology data values and results of the one or more second tests;
receiving a second plurality of the integrated circuit;
determining, for the second plurality of the integrated circuit, values for the electrical properties of a first plurality of the circuitry layers, the first plurality of the circuitry layers including circuitry layers other than the first subset of the circuitry layers; and
interpolating metrology data values for the first plurality of the circuitry layers of the second plurality of the integrated circuit from the correlation and results of the values for the electrical properties of the first plurality of the circuitry layers.
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