US 12,009,247 B2
Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
Sidlgata V. Sreenivasan, Austin, TX (US); Paras Ajay, Austin, TX (US); Aseem Sayal, Austin, TX (US); Mark McDermott, Austin, TX (US); Shrawan Singhal, Austin, TX (US); Ovadia Abed, Austin, TX (US); Lawrence Dunn, Austin, TX (US); Vipul Goyal, Austin, TX (US); and Michael Cullinan, Austin, TX (US)
Assigned to Board of Regents, The University of Texas System, Austin, TX (US)
Filed by Board of Regents, The University of Texas System, Austin, TX (US)
Filed on Oct. 4, 2022, as Appl. No. 17/959,932.
Application 17/959,932 is a continuation of application No. 16/472,766, granted, now 11,469,131, previously published as PCT/US2017/068328, filed on Dec. 22, 2017.
Claims priority of provisional application 62/438,952, filed on Dec. 23, 2016.
Prior Publication US 2023/0042873 A1, Feb. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); B81C 99/00 (2010.01); G06F 30/392 (2020.01); G06F 30/396 (2020.01); G06F 30/398 (2020.01); G06F 117/10 (2020.01); H01L 23/544 (2006.01)
CPC H01L 21/6835 (2013.01) [B81C 99/002 (2013.01); G06F 30/392 (2020.01); G06F 30/396 (2020.01); G06F 30/398 (2020.01); H01L 21/6838 (2013.01); H01L 23/544 (2013.01); G06F 2117/10 (2020.01); H01L 2221/68309 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01)] 37 Claims
OG exemplary drawing
 
1. A method for assembling components onto a product substrate, the method comprising:
selectively picking one or more elements from a source wafer by a vacuum superstrate attached to said one or more elements;
placing said selectively picked one or more elements onto an adhesive on said product substrate with sub-100 nm placement precision, wherein said adhesive is in a liquid state at a time of said placing which enables said sub-100 nm placement precision, wherein said adhesive is inkjetted or spin-coated onto said product substrate; and
securely attaching said selectively picked one or more elements onto said product substrate by holding onto said one or more elements using said vacuum superstrate until said adhesive reaches its gel point.