US 12,009,231 B2
Method of bonding substrates utilizing a substrate holder with holding fingers
Jun-hyung Kim, Yongin-si (KR); Sung-hyup Kim, Hwaseong-si (KR); and Tae-yeong Kim, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 10, 2023, as Appl. No. 18/119,909.
Application 18/119,909 is a continuation of application No. 16/507,407, filed on Jul. 10, 2019, granted, now 11,640,912.
Claims priority of application No. 10-2018-0103029 (KR), filed on Aug. 30, 2018.
Prior Publication US 2023/0215744 A1, Jul. 6, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/673 (2006.01); H01L 21/687 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 27/146 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/673 (2013.01); H01L 21/68735 (2013.01); H01L 22/12 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 25/50 (2013.01); H01L 27/1469 (2013.01); H01L 2221/683 (2013.01); H01L 2224/05 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate bonding method, comprising:
arranging a substrate susceptor to hold a first substrate thereon;
arranging a substrate holder to hold a second substrate thereon such that the first and second substrates are aligned with each other, the substrate holder including a plurality of holding fingers configured to hold an edge of the second substrate and move independently from each other;
bringing a center of the second substrate to contact the first substrate;
allowing a spontaneous bonding propagation between the first substrate and the second substrate to occur;
bringing the second substrate closer to the first substrate while holding the edge of the second substrate; and
releasing the holding of the edge of the second substrate.