US 12,009,230 B2
Bonding device as well as method for bonding substrates
George Gregory, Garching (DE)
Assigned to SUSS MICROTEC LITHOGRAPHY GMBH, (DE)
Appl. No. 17/611,086
Filed by SUSS MicroTec Lithography GmbH, Garching (DE)
PCT Filed May 13, 2019, PCT No. PCT/EP2019/062234
§ 371(c)(1), (2) Date Nov. 12, 2021,
PCT Pub. No. WO2020/228940, PCT Pub. Date Nov. 19, 2020.
Prior Publication US 2022/0230895 A1, Jul. 21, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/67017 (2013.01); H01L 21/67248 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A bonding device for bonding substrates, comprising a first chuck, a second chuck, a first gas pressure regulator, a movable first support element and a first actuator for the first support element,
wherein the first chuck comprises a first holding surface for holding a first substrate, the first holding surface having a first pressure port fluidically connected to the first gas pressure regulator,
wherein the first support element is mounted movably at least partially within the first pressure port such that the first actuator is able to move the first support element between a retracted position, in which the first support element does not protrude above the first holding surface, and an extended position, in which the first support element protrudes above the first holding surface towards the second chuck.
 
12. A method for bonding a first substrate to a second substrate using a bonding device as claimed in claim 1, said bonding device comprising a first chuck with a first pressure port and a first support element and a second chuck, the method comprising the following steps:
a) placing the first substrate on the first chuck covering the first pressure port and fixing the edge portion of the first substrate to the first chuck,
b) placing the second substrate on the second chuck and fixing the second substrate to the second chuck,
c) supplying gas with a first gas pressure to the first pressure port so that the first substrate is deflected towards the second substrate,
d) moving the first support element to an extended position, in which the first support element protrudes above the first chuck towards the second chuck, and
e) moving the first chuck and the second chuck relative to each other towards each other at least until the first substrate and the second substrate are in contact with one another.