US 12,009,228 B2
Low temperature chuck for plasma processing systems
Toan Q. Tran, San Jose, CA (US); Zilu Weng, San Diego, CA (US); Dmitry Lubomirsky, Cupertino, CA (US); Satoru Kobayashi, Sunnyvale, CA (US); Tae Seung Cho, San Jose, CA (US); Soonam Park, Sunnyvale, CA (US); Son M. Phi, Milpitas, CA (US); and Shankar Venkataraman, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 27, 2023, as Appl. No. 18/175,104.
Application 18/175,104 is a continuation of application No. 15/581,497, filed on Apr. 28, 2017, granted, now 11,594,428.
Application 15/581,497 is a continuation of application No. 14/612,857, filed on Feb. 3, 2015, abandoned.
Prior Publication US 2023/0223281 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/311 (2006.01)
CPC H01L 21/67069 (2013.01) [H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A wafer chuck assembly, comprising:
a shaft;
a puck coupled with the shaft, the puck comprising:
an electrically insulating material defining a top surface of the puck, wherein the electrically insulating material defines a recessed ledge extending to an outer radius of the electrically insulating material;
a plurality of electrodes embedded within the electrically insulating material;
an inner puck element that forms one or more channels for a heat exchange fluid; and
an electrically conductive plate comprising a body disposed in contact with the inner puck element and defining a recessed cavity, wherein the inner puck element is seated within the recessed cavity, wherein the electrically conductive plate defines an outer radius of the puck, and wherein the electrically conductive plate defines an exterior housing of the shaft; and
a ring element seated atop the top surface of the puck, the ring element comprising a body extending about the puck, wherein a first downward-facing portion of the ring element is disposed on and in contact with the recessed ledge of the electrically insulating material and a second downward-facing portion of the ring element is disposed on and in contact with an upward-facing portion of the electrically conductive plate defining the recessed cavity within the electrically conductive plate.