US 12,009,225 B2
Electrically conductive vias and methods for producing same
Alan Nolet, Hillsborough, CA (US); Daniel Goia, Flemington, NJ (US); Vishwas Hardikar, San Diego, CA (US); Ajeet Kumar, Piscataway, NJ (US); Daniel Long, El Dorado Hills, CA (US); and Andrew Liotta, Cambridge, MA (US)
Assigned to SAMTEC, INC., New Albany, IN (US)
Appl. No. 17/043,998
Filed by SAMTEC, INC., New Albany, IN (US)
PCT Filed Mar. 29, 2019, PCT No. PCT/US2019/024891
§ 371(c)(1), (2) Date Sep. 30, 2020,
PCT Pub. No. WO2019/191621, PCT Pub. Date Oct. 3, 2019.
Claims priority of provisional application 62/651,074, filed on Mar. 30, 2018.
Prior Publication US 2021/0043464 A1, Feb. 11, 2021
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01)
CPC H01L 21/486 (2013.01) [H01L 23/49827 (2013.01); H01L 23/15 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electrical component comprising:
a substrate defining a first surface and a second surface opposite the first surface, and a hole that extends from the first surface to the second surface; and
an electrically conductive metal fill that extends in the hole from the first surface to the second surface so as to define an electrically conductive via, wherein the electrically conductive fill defines an electrically conductive path from the first surface to the second surface,
wherein the metal fill comprises sintered metal particles, and a majority of the metal particles are substantially non-densification sintered, and
wherein respective geometric centers of adjacent substantially non-densification sintered metal particles are spaced apart a distance that defines a difference with respect a distance between the geometric centers prior to sintering, and the difference is no more than 30% of the distance between the geometric centers prior to sintering.