US 12,009,221 B2
Performing planarization process controls in semiconductor fabrication
Chunhung Chen, Hsinchu (TW); Sheng-Chen Wang, Taichung (TW); and Chin Wei Chuang, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Oct. 17, 2019, as Appl. No. 16/656,393.
Application 16/656,393 is a division of application No. 15/879,490, filed on Jan. 25, 2018, granted, now 10,468,270.
Claims priority of provisional application 62/592,587, filed on Nov. 30, 2017.
Prior Publication US 2020/0051830 A1, Feb. 13, 2020
Int. Cl. H01L 21/321 (2006.01); G01N 23/20 (2018.01); G06F 11/07 (2006.01); H01L 21/66 (2006.01); B24B 37/013 (2012.01); G01N 1/10 (2006.01)
CPC H01L 21/3212 (2013.01) [G01N 23/20075 (2013.01); G06F 11/07 (2013.01); H01L 22/26 (2013.01); B24B 37/013 (2013.01); G01N 1/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a chemical-mechanical-polishing (CMP) tool configured to polish a wafer, wherein a polishing of the wafer generates byproducts;
a byproduct-collection tool configured to collect at least some of the byproducts generated during the polishing of the wafer;
a sensor, an analyzer, and first computer configured to analyze the collected byproducts, wherein an analysis of the collected byproducts indicates:
a presence of an unexpected atomic element that corresponds to a contaminant material in the collected byproducts; or
an unexpected chronological sequence in which a plurality of atomic elements in the collected byproducts appear; and
an industrial-grade computer configured to instruct the CMP tool to adjust the polishing of the wafer based on the analysis of the collected byproducts indicating an error that includes a contamination of the CMP tool, an over-polishing of the wafer, or an under-polishing of the wafer.