US 12,009,190 B2
Plasma processing system and plasma processing method
Hiroshi Shirouzu, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Apr. 11, 2022, as Appl. No. 17/658,670.
Claims priority of application No. 2021-068963 (JP), filed on Apr. 15, 2021.
Prior Publication US 2022/0336197 A1, Oct. 20, 2022
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32935 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32926 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A plasma processing system, comprising:
a plasma processing apparatus including a processing chamber for plasma processing an object to be processed, and at least one component which is at least partially disposed in the processing chamber;
a storage unit for storing a recipe including a set value specifying a plasma processing condition;
a tolerance determination unit that determines a tolerance of the set value, based on a degree of deterioration of the at least one component; and
a recipe modification unit that modifies the recipe such that the set value falls within the tolerance, when the set value is outside the tolerance.