US 12,009,187 B2
Plasma shutter and substrate processing apparatus including the same
Hyungsik Ko, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 9, 2023, as Appl. No. 18/208,046.
Claims priority of application No. 10-2022-0116697 (KR), filed on Sep. 15, 2022; and application No. 10-2023-0015153 (KR), filed on Feb. 3, 2023.
Prior Publication US 2024/0096606 A1, Mar. 21, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32807 (2013.01) [H01J 37/32495 (2013.01); H01J 37/32513 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a process chamber;
a plasma shutter configured ascend to close the process chamber; and
an upper liner on the process chamber,
wherein the process chamber comprises:
a process space in which a substrate process is performed; and
an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber,
wherein the upper liner comprises an extension liner,
wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and
wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.