US 12,009,154 B2
Multilayer electronic component with conductive resin layer
Ji Hye Han, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); Byung Woo Kang, Suwon-si (KR); Hong Je Choi, Suwon-si (KR); Hye Jin Park, Suwon-si (KR); Sang Wook Lee, Suwon-si (KR); Bon Seok Koo, Suwon-si (KR); and Jung Won Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 28, 2022, as Appl. No. 17/682,023.
Claims priority of application No. 10-2021-0139074 (KR), filed on Oct. 19, 2021.
Prior Publication US 2023/0119122 A1, Apr. 20, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body,
wherein the external electrode includes:
an electrode layer connected to the internal electrode,
an intermetallic compound layer disposed on the electrode layer and including a plurality of portions spaced apart from each other in a cross section, each portion having a first intermetallic compound, and
a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin,
in the cross section, a ratio of a length of a first direction component of a region having the plurality of portions having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more, and
the intermetallic compound layer include glass to be disposed between two portions among the plurality of portions having the first intermetallic compound.