US 12,009,148 B2
Integrated circuit having current-sensing coil
Alan Roth, Hsinchu (TW); and Eric Soenen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Jan. 19, 2023, as Appl. No. 18/156,657.
Application 18/156,657 is a continuation of application No. 17/125,020, filed on Dec. 17, 2020, granted, now 11,569,030.
Application 17/125,020 is a continuation of application No. 15/053,619, filed on Feb. 25, 2016, granted, now 10,878,997, issued on Dec. 29, 2020.
Claims priority of provisional application 62/133,228, filed on Mar. 13, 2015.
Prior Publication US 2023/0154675 A1, May 18, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 38/30 (2006.01); G01R 15/18 (2006.01); H01F 5/00 (2006.01); H01L 23/522 (2006.01)
CPC H01F 38/30 (2013.01) [G01R 15/183 (2013.01); H01F 5/003 (2013.01); H01L 23/5227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a first conductive path over a substrate, the first conductive path being configured to carry a first time-varying current and to generate a first time-varying magnetic field based on the first time-varying current;
a coil structure over the substrate, the coil structure being magnetically coupled with the first conductive path, and being configured to generate an induced electrical potential responsive to the first time-varying magnetic field; and
a ferromagnetic structure including an open portion, the first conductive path extending through the open portion of the ferromagnetic structure, the first conductive path comprising:
a first conductive line below the ferromagnetic structure;
a second conductive line above the ferromagnetic structure; and
a first via plug coplanar with the ferromagnetic structure, the first via plug electrically coupling the first conductive line and the second conductive line.