CPC H01B 7/40 (2013.01) [B60R 16/0215 (2013.01); H02G 3/305 (2013.01); H05B 6/10 (2013.01)] | 6 Claims |
1. A fixing structure of a wiring member, comprising:
a wiring member including at least one wire-like transmission member;
a heat generation layer provided to surround a periphery of the wiring member;
an adherend to which the wiring member is fixed; and
a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein
the heat generation layer is a layer which can generate heat by induction heating,
the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member,
the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend, and
a fixation surface of the adherend is a planar surface, and the adherend side joint layer is provided to extend along the fixation surface.
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