US 12,008,833 B2
Capacitive fingerprint identification apparatus, preparation method and electronic device
Xiangying Liu, Guangdong (CN); and Xiaofeng Duan, Guangdong (CN)
Assigned to SHENZHEN GOODIX TECHNOLOGY CO., LTD., Guangdong (CN)
Filed by SHENZHEN GOODIX TECHNOLOGY CO., LTD., Guangdong (CN)
Filed on Jul. 21, 2022, as Appl. No. 17/869,887.
Application 17/869,887 is a continuation of application No. PCT/CN2020/113657, filed on Sep. 6, 2020.
Prior Publication US 2022/0375249 A1, Nov. 24, 2022
Int. Cl. G06V 40/13 (2022.01)
CPC G06V 40/1306 (2022.01) 14 Claims
OG exemplary drawing
 
1. A capacitive fingerprint identification apparatus, configured to be provided on an arc-shaped surface of an electronic device, comprising:
a capacitive fingerprint identification package structure;
an arc surface structure, comprising a first surface and a second surface, wherein the first surface of the arc surface structure is a plane, the second surface of the arc surface structure is an arc surface, and the first surface of the arc surface structure is connected to a first surface of the capacitive fingerprint identification package structure, and the first surface of the capacitive fingerprint identification package structure is a surface facing the outside of the electronic device, wherein a material of the arc surface structure is a high temperature resistant ultraviolet (UV) light glue, and a dielectric constant of the arc surface structure is greater than 3.4.