US 12,007,818 B2
Floating heat spreader for processing assembly
Robert Cao, San Francisco, CA (US); Zoran Stefanoski, San Francisco, CA (US); Brian Schlotterbeck, San Francisco, CA (US); Wen-chieh Tang, San Francisco, CA (US); and Roger Lo, San Francisco, CA (US)
Assigned to GM Cruise Holdings LLC, San Francisco, CA (US)
Filed by GM Cruise Holdings LLC, San Francisco, CA (US)
Filed on May 6, 2020, as Appl. No. 16/867,918.
Prior Publication US 2021/0349507 A1, Nov. 11, 2021
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); G05D 1/00 (2006.01)
CPC G06F 1/20 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20509 (2013.01); G05D 1/0088 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An automated driving system computer comprising:
a board;
one or more processors coupled to the board;
a first layer of a first thermal interface material applied on the one or more processors;
a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, the heat spreader having a shoulder extending therefrom;
a heat transfer component embedded in the heat spreader, the heat transfer component configured to collect heat from the first side of the heat spreader in contact with the first layer of the first thermal interface material applied on the one or more processors, and transfer the heat to the second side of the heat spreader;
a fastener disposed through the shoulder of the heat spreader, the fastener securing the heat spreader to the board;
a spring disposed around the fastener, wherein the spring presses against the shoulder of the heat spreader and thereby compresses the heat spreader against the one or more processors;
a bushing disposed between the fastener and the spring, wherein the bushing insulates the heat spreader to prevent heat from transferring to the fastener and the board, and wherein the bushing dampens energy transfer between the heat spreader, the fastener, and the board;
a second layer of a second thermal interface material applied on the second side of the heat spreader; and
a cold plate in contact with the second layer of the second thermal interface material.