US 12,007,702 B2
Measurement device, lithography system and exposure apparatus, and control method, overlay measurement method and device manufacturing method
Yuichi Shibazaki, Kumagaya (JP)
Assigned to NIKON CORPORATION, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on Jul. 22, 2022, as Appl. No. 17/870,907.
Application 17/870,907 is a division of application No. 16/878,963, filed on May 20, 2020, granted, now 11,435,672.
Application 16/878,963 is a division of application No. 15/673,333, filed on Aug. 9, 2017, granted, now 10,698,326, issued on Jun. 30, 2020.
Application 15/673,333 is a continuation of application No. PCT/JP2016/055132, filed on Feb. 23, 2016.
Claims priority of application No. 2015-032910 (JP), filed on Feb. 23, 2015.
Prior Publication US 2022/0365453 A1, Nov. 17, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 9/00 (2006.01); G01B 11/00 (2006.01); G01D 5/347 (2006.01); G03F 7/00 (2006.01)
CPC G03F 9/7046 (2013.01) [G01B 11/00 (2013.01); G01B 11/002 (2013.01); G01D 5/34746 (2013.01); G03F 7/70633 (2013.01); G03F 7/70775 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A measurement device that acquires position information of marks formed on a substrate which is held on a substrate holder provided in an exposure apparatus and to which exposure processing is performed, the device comprising:
a first detection system that detects each of a plurality of marks provided at each of a plurality of divided areas formed on the substrate;
a stage that is movable and configured to hold the substrate on a holding member different from the substrate holder;
a position measurement system capable of acquiring position information of the stage; and
a controller that obtains position information of each of the plurality of marks, based on a detection result of the first detection system and the position information of the stage acquired by the position measurement system, wherein
the controller obtains change of grid information with respect to the exposure apparatus which performs the exposure processing to the substrate, the grid information representing an arrangement information of the plurality of divided areas, based on a difference between the position information of each of the plurality of divided areas which is obtained from the position information of the plurality of marks and a design position information of each of the plurality of divided areas.