US 12,007,692 B2
Nozzle, substrate processing apparatus, and substrate processing method
Hiroki Sakurai, Koshi (JP); Nobuhiro Ogata, Koshi (JP); Daisuke Goto, Koshi (JP); Kanta Mori, Koshi (JP); Kenji Yada, Koshi (JP); Yusuke Hashimoto, Koshi (JP); Shoki Mizuguchi, Koshi (JP); and Yenrui Hsu, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Dec. 8, 2022, as Appl. No. 18/077,577.
Claims priority of application No. 2021-202225 (JP), filed on Dec. 14, 2021.
Prior Publication US 2023/0185199 A1, Jun. 15, 2023
Int. Cl. G03F 7/30 (2006.01); G03F 7/42 (2006.01)
CPC G03F 7/3021 (2013.01) [G03F 7/426 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A nozzle that mixes a fluid containing steam or mist of pressurized pure water and a processing liquid containing at least sulfuric acid and ejects a mixed fluid of the fluid and the processing liquid, the nozzle comprising:
at least one first ejection port configured to eject the fluid;
at least one second ejection port configured to eject the processing liquid; and
at least one lead-out path extending vertically downward to form an inner wall surface, configured to be in fluid communication with the at least one first ejection port and the at least one second ejection port, and configured to lead out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port,
wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to a position deviated from a central axis of the at least one lead-out path in a plan view.