US 12,007,691 B2
Substrate measuring device and a method of using the same
Min-Cheng Wu, Hsinchu (TW); and Chi-Hung Liao, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 30, 2022, as Appl. No. 17/855,591.
Application 17/374,753 is a division of application No. 16/049,678, filed on Jul. 30, 2018, granted, now 11,092,892, issued on Aug. 17, 2021.
Application 17/855,591 is a continuation of application No. 17/374,753, filed on Jul. 13, 2021, granted, now 11,409,201.
Prior Publication US 2022/0334490 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/20 (2006.01); G03F 1/42 (2012.01); G03F 7/00 (2006.01); G03F 9/00 (2006.01)
CPC G03F 7/2022 (2013.01) [G03F 1/42 (2013.01); G03F 7/2004 (2013.01); G03F 7/70625 (2013.01); G03F 7/7085 (2013.01); G03F 9/7065 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for semiconductor processing, the method comprising:
providing beams of light from an emitter, wherein the beams of light have multiple wavelengths;
passing the beams of light have multiple wavelengths through a polarizer;
providing the beams of light that have passed through the polarizer to a substrate via at least one optical fiber including multiple zones, each of the multiple zones including strands of optical fibers, a material of the strands of optical fibers of a zone being different from the material of the strands of optical fibers of a different zone, the substrate include materials having different transmittance with respect to the beams of light having the multiple wavelengths;
collecting reflected light of the beams of light at a receiver, the reflected light being reflected off of the substrate;
determining a variation of height of the substrate based on the collected reflected light; and
aligning the substrate with an optical focusing module in response to the determined variation of height of the substrate.