US 12,007,451 B2
Method and system for thermal control of devices in an electronics tester
Jovan Jovanovic, Santa Clara, CA (US); Kenneth W. Deboe, Santa Clara, CA (US); and Steven C. Steps, Saratoga, CA (US)
Assigned to AEHR TEST SYSTEMS, Fremont, CA (US)
Filed by AEHR TEST SYSTEMS, Fremont, CA (US)
Filed on Nov. 22, 2021, as Appl. No. 17/532,298.
Application 17/532,298 is a division of application No. 16/576,555, filed on Sep. 19, 2019, granted, now 11,209,497.
Application 16/576,555 is a division of application No. 15/400,771, filed on Jan. 6, 2017, granted, now 10,466,292, issued on Nov. 5, 2019.
Claims priority of provisional application 62/276,746, filed on Jan. 8, 2016.
Prior Publication US 2022/0082636 A1, Mar. 17, 2022
Int. Cl. G01R 31/50 (2020.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); H01L 21/324 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/50 (2020.01) [G01R 31/003 (2013.01); G01R 31/2831 (2013.01); G01R 31/2875 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/68785 (2013.01); H01L 22/26 (2013.01); G01R 1/0491 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A tester apparatus comprising:
a frame;
a plurality of slot assemblies, each slot assembly including:
a slot assembly body mounted to the frame:
a holder mounted to the slot assembly body and forming a testing station for placement of a respective wafer, the respective wafer having at least one microelectronic device;
a plurality of electrical conductors; and
a temperature detector in proximity to the respective wafer to detect a temperature of the respective wafer;
at least one temperature modification device, which, when operated causes a transfer of heat to or from the wafers; and
a tester connected through the electrical conductors to the wafers in the testing stations to test the microelectronic devices by providing at least power to each microelectronic device and measuring a performance of the microelectronic device, wherein at least one of the conductors of a first of the slot assemblies is releasably connectable between a first of the wafers and the power while at the same time transferring heat to or from a second of the wafers that is connected to the power.