CPC G01R 31/2853 (2013.01) [G01R 31/2856 (2013.01)] | 20 Claims |
1. A method for testing connectivity between a first integrated circuit (IC) and a second IC of an electronics package, the method comprising:
determining a measure of connectivity between the first IC and a photodiode in the second IC when a bias direction of the photodiode is forward biased, wherein determining the measure of connectivity comprises measuring a current flow through the photodiode when the bias direction of the photodiode is forward biased; and
determining whether there is a fault with at least one of the first IC or the second IC based on the measured current flow.
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