US 12,007,170 B2
Thermal management in integrated circuit packages
Feras Eid, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 6, 2019, as Appl. No. 16/533,235.
Prior Publication US 2021/0041182 A1, Feb. 11, 2021
Int. Cl. F28D 15/04 (2006.01); H01L 23/367 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01)
CPC F28D 15/046 (2013.01) [H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/38 (2013.01); H01L 23/427 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A vapor chamber, comprising:
an evaporator having a wick region at a first portion of an interior surface of the evaporator;
a condenser having an interior surface facing the interior surface of the evaporator; and
side walls between the interior surface of the condenser and the interior surface of the evaporator, the side walls sealing a vapor space between the interior surface of the condenser and the interior surface of the evaporator,
wherein:
the interior surface of the evaporator further includes a second portion,
the second portion is outside of the wick region,
within the vapor space, the second portion is angled toward the wick region and is in contact with the first portion, and
the vapor space separates the second portion and the condenser.