US 12,006,848 B2
Device and method for the utilisation of low-temperature heat by decoupling the low-temperature heat from process gas, and use
Marco Scholz, Dortmund (DE)
Assigned to thyssenkrupp Uhde GmbH, Dortmund (DE); and thyssenkrupp AG, Essen (DE)
Appl. No. 17/280,955
Filed by thyssenkrupp Industrial Solutions AG, Essen (DE); and thyssenkrupp AG, Essen (DE)
PCT Filed May 13, 2020, PCT No. PCT/EP2020/063321
§ 371(c)(1), (2) Date Mar. 29, 2021,
PCT Pub. No. WO2020/239444, PCT Pub. Date Dec. 3, 2020.
Claims priority of application No. 10 2019 207 957.1 (DE), filed on May 29, 2019.
Prior Publication US 2022/0120199 A1, Apr. 21, 2022
Int. Cl. F01K 23/06 (2006.01); F01K 3/18 (2006.01)
CPC F01K 23/064 (2013.01) [F01K 3/188 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A low-temperature heat utilization assembly configured to decouple low-temperature heat from process gas at temperatures below 200° C. wherein the low-temperature heat utilization assembly is configured to receive the process gas from a hydrogen plant being a steam reformer plant located upstream of the low-temperature heat utilization assembly and to provide the process gas at a lowered intermediate temperature to a pressure swing adsorption plant located downstream of the low-temperature heat utilization assembly, the low-temperature heat utilization assembly comprising:
an ORC unit configured to be fed the process gas, wherein the ORC unit is configured to lower a temperature of the process gas to the lowered intermediate temperature, wherein the ORC unit is configured for energy transformation of heat energy into electrical energy, wherein the ORC unit is at least one of:
coupled to an electrical consumer unit or a line for energy export, or
configured for energy feedback of electrical energy within the low-temperature heat utilization assembly or to a process in the hydrogen plant located upstream of the ORC unit.