	US 12,006,447 B2
	Epoxy conductive paste and preparation method and application thereof
Wen Shi, Shenzhen (CN); Fengzhen Sun, Shenzhen (CN); and Delin Li, San Jose, CA (US)
Assigned to Soltrium Advanced Materials Technology, Ltd
Appl. No. 17/413,564
Filed by Soltrium Advanced Materials Technology, Ltd, Shenzhen (CN)
PCT Filed Jan. 17, 2020, PCT No. PCT/CN2020/072632 § 371(c)(1), (2) Date Jun. 13, 2021, PCT Pub. No. WO2021/142748, PCT Pub. Date Jul. 22, 2021.
Prior Publication US 2022/0348799 A1, Nov. 3, 2022
Int. Cl. C09J 11/04 (2006.01); C08K 3/08 (2006.01); C08K 5/5415 (2006.01); C08K 7/00 (2006.01); C08K 9/02 (2006.01); C09J 9/02 (2006.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01)

CPC C09J 11/04 (2013.01) [C08K 3/08 (2013.01); C08K 5/5415 (2013.01); C08K 7/00 (2013.01); C08K 9/02 (2013.01); C09J 9/02 (2013.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/085 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01)]

18 Claims

1. An epoxy conductive paste comprising, based on 100 parts by total mass, following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, and 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, 0.4˜5 parts of cationic curing agent;

wherein the conductive particles comprise conductive particles with a three-dimensional dendritic microstructure;

wherein the conductive particles with the three-dimensional dendritic microstructure are characterized by a specific surface area limited in a range of 0.2˜3.5 m²/g.