US 12,006,442 B2
Additive manufacturing of polishing pads
Atul Bhaskar Chaudhari, Mumbai (IN); Sivapackia Ganapathiappan, Los Altos, CA (US); and Srobona Sen, Maharashtra (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 12, 2019, as Appl. No. 16/681,700.
Claims priority of application No. 201941036561 (IN), filed on Sep. 11, 2019.
Prior Publication US 2021/0071017 A1, Mar. 11, 2021
Int. Cl. B33Y 70/00 (2020.01); B24B 37/24 (2012.01); C08G 18/10 (2006.01); C08G 18/24 (2006.01); C08G 18/42 (2006.01); C08G 18/67 (2006.01); C09D 11/102 (2014.01); C09D 11/30 (2014.01)
CPC C09D 11/102 (2013.01) [B24B 37/24 (2013.01); B33Y 70/00 (2014.12); C08G 18/10 (2013.01); C08G 18/246 (2013.01); C08G 18/4238 (2013.01); C08G 18/6755 (2013.01); C09D 11/30 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of manufacturing a polishing pad, comprising:
correlating multiple difunctional polyols with a property of a polishing layer of the polishing pad, wherein the property comprises ultimate tensile strength (UTS), storage modulus, glass transition temperature, or melting point, or any combinations thereof, wherein the multiple difunctional polyols comprise linear aliphatic polyester polyols;
selecting a difunctional polyol that is a linear aliphatic polyester polyol of the multiple difunctional polyols to affect the property of the polishing layer of the polishing pad to give a specified value of the property;
performing a catalytic reaction of the difunctional polyol as selected with a difunctional isocyanate to give a urethane oligomer;
capping the urethane oligomer with an acrylate to give a urethane acrylate oligomer, wherein the urethane acrylate oligomer as applied in additive manufacturing of the polishing pad affects the property to give the specified value; and
performing the additive manufacturing including injecting a formulation through a three dimensional (3D) printer nozzle to form the polishing layer of the polishing pad, the formulation comprising 15 weight percent (wt %) to 25 wt % of the urethane acrylate oligomer and 70 wt % to 80 wt % of an acrylic monomer, wherein the polishing layer comprises a storage modulus at 90° C. in a range of 100 megapascal (MPa) to 300 MPa, and wherein the polishing pad comprises a chemical-mechanical planarization (CMP) pad.