	US 12,006,433 B2
	Thermosetting resin composition, resin sheet, laminate, and printed wiring board
Kouichi Aoki, Hyogo (JP); Tomoyuki Aoki, Osaka (JP); and Eiichiro Saito, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/426,917
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Jan. 30, 2020, PCT No. PCT/JP2020/003367 § 371(c)(1), (2) Date Jul. 29, 2021, PCT Pub. No. WO2020/158849, PCT Pub. Date Aug. 6, 2020.
Claims priority of application No. 2019-016437 (JP), filed on Jan. 31, 2019.
Prior Publication US 2022/0098404 A1, Mar. 31, 2022
Int. Cl. C08L 71/12 (2006.01); C08F 255/06 (2006.01); C08F 283/08 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01)

CPC C08L 71/126 (2013.01) [C08F 255/06 (2013.01); C08F 283/08 (2013.01); C08L 2201/02 (2013.01); C08L 2205/035 (2013.01); H05K 3/022 (2013.01); H05K 3/4611 (2013.01); H05K 3/4673 (2013.01); H05K 2201/0195 (2013.01)]

11 Claims

1. A thermosetting resin composition comprising:

a radical polymerizable unsaturated compound (A);

an organic radical compound (C), and

a styrene-based elastomer (E);

the radical polymerizable unsaturated compound (A) containing:

a copolymer (A1) having a structural unit derived from mono-olefin and a structural unit derived from diene; and

a terminal modified polyphenylene ether compound (A2), and

a content of the elastomer (E) falling within the range from 5 parts by mass to 100 parts by mass with respect to 100 parts by mass in total of the copolymer (A1) and the compound (A2).