US 12,006,207 B2
Pressure sensor including a microelectromechanical transducer and relating pressure-detection method
Mario Giuseppe Pavone, Giarre (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed on Nov. 30, 2022, as Appl. No. 18/060,333.
Application 18/060,333 is a division of application No. 16/799,747, filed on Feb. 24, 2020, granted, now 11,535,508.
Claims priority of application No. 102019000002663 (IT), filed on Feb. 25, 2019.
Prior Publication US 2023/0104798 A1, Apr. 6, 2023
Int. Cl. B81B 3/00 (2006.01); G01L 9/00 (2006.01)
CPC B81B 3/0037 (2013.01) [G01L 9/0054 (2013.01); B81B 2201/0264 (2013.01)] 20 Claims
OG exemplary drawing
 
15. A method, comprising:
deforming a first layer of a first stiffness of a pressure sensor towards a sealed main cavity within the pressure sensor by exerting a pressure on a first external surface of the first layer of the pressure sensor; and
detecting the pressure exerted on the pressure sensor with a solid body by a MEMS (microelectromechanical system) device within the sealed main cavity of the pressure sensor, detecting the pressure exerted on the pressure sensor by the solid body including:
deforming a deformable structure within a cavity of the MEMS device in fluid communication with the sealed main cavity through a hole extending through the MEMS device to the cavity; and
detecting deformation of the deformable structure with a transducer on the deformable structure.