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1. A processing machine for processing a substrate comprising at least one shaping unit and/or at least one application unit, the at least one application unit and/or the at least one shaping unit, each comprising at least one forme cylinder and at least one impression cylinder, the at least one forme cylinder of the application unit comprising at least one application forme including at least one application surface and/or the at least one shaping unit comprising at least one shaping tool including at least one working surface, the application surface and/or the working surface being arranged so as to cover a first portion of the outer cylindrical surface of the at least one forme cylinder, a gap, in which processing is not performed, extending over a second portion of the outer cylindrical surface of the at least one forme cylinder, the processing machine comprising at least one control unit for correcting a processing length and/or printing length, which controls, in an open loop and/or a closed loop, a speed of the at least one forme cylinder and/or of the at least one impression cylinder, the speed of the at least one forme cylinder and/or the speed of the at least one impression cylinder having a speed ratio with respect to one another, the application surface of the at least one application forme and/or the working surface of the at least one shaping tool being subdivided into a plurality of sections for processing multiple-ups of the substrate which are arranged one behind the other, characterized in that, during a full cylinder revolution of the at least one forme cylinder, the at least one forme cylinder and the at least one impression cylinder have a first speed ratio when a first section of the plurality of sections of the working surface passes through the processing point and/or when a first section of the plurality of sections of the application surface passes through the processing point, and that the at least one forme cylinder and the at least one impression cylinder have a second speed ratio that differs from the first speed ratio when a second section of the working surface passes through the processing point and/or when a second section of the application surface passes through the processing point, wherein the at least one control unit adjusts a phase position of the at least one forme cylinder as the gap passes the processing point for matching the application surface and/or the working surface with a next substrate.
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