US 12,005,670 B2
RFID tag manufacturing system
Yoshinori Yamawaki, Nagaokakyo (JP); Noboru Kato, Nagaokakyo (JP); and Ryosuke Washida, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 21, 2022, as Appl. No. 17/660,112.
Application 17/660,112 is a continuation of application No. PCT/JP2021/015412, filed on Apr. 14, 2021.
Claims priority of application No. 2020-080572 (JP), filed on Apr. 30, 2020.
Prior Publication US 2022/0242081 A1, Aug. 4, 2022
Int. Cl. B31D 1/02 (2006.01); B31D 1/00 (2017.01); G06K 1/12 (2006.01); G06K 19/077 (2006.01)
CPC B31D 1/028 (2013.01) [B31D 1/0075 (2013.01); B31D 1/026 (2013.01); G06K 1/12 (2013.01); G06K 19/07718 (2013.01); B31D 2201/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An RFID tag manufacturing system comprising:
a conveyance device configured to convey a base sheet provided with a plurality of antenna patterns that each have an RFIC module fixed thereto;
a first laminating device configured to attach a cover seal on the base sheet to cover the plurality of antenna patterns; and
a punching device configured to produce a plurality of RFID tags that each include one of the plurality of antenna patterns by punching the cover seal and the base sheet with a punching blade to form a frame-shaped cut, with the punching blade including a frame-shaped cutting edge that surrounds one of the plurality of antenna patterns,
wherein the cover seal is smaller in size than the base sheet,
wherein the base sheet includes an alignment mark, and
wherein a position of the punching device relative to each of the plurality of antenna patterns covered with the cover seal is specified based on the alignment mark, and wherein the punching device is configured to punch the cover seal and the base sheet based on the specified position.