CPC B29C 70/70 (2013.01) [A45C 11/00 (2013.01); B29C 51/08 (2013.01); B29C 51/14 (2013.01); B29C 51/264 (2013.01); B29C 70/88 (2013.01); B32B 3/08 (2013.01); B32B 3/266 (2013.01); B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 37/04 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/18 (2013.01); B32B 37/26 (2013.01); B32B 38/0004 (2013.01); A45C 2011/002 (2013.01); A45C 2011/003 (2013.01); B29K 2105/0097 (2013.01); B29K 2277/10 (2013.01); B29K 2309/08 (2013.01); B29K 2995/0008 (2013.01); B29L 2031/3481 (2013.01); B32B 2037/268 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2305/076 (2013.01); B32B 2307/208 (2013.01); B32B 2307/7376 (2023.05); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2315/085 (2013.01); B32B 2377/00 (2013.01); B32B 2457/00 (2013.01); B32B 2571/00 (2013.01)] | 16 Claims |
1. A protective case for electronic device, comprising:
an inner shell;
an outer shell; and
a magnetic interlayer disposed between and in contact with the inner shell and the outer shell, wherein:
the magnetic interlayer includes an interlayer base material and a magnetic part, the interlayer base material including an inner side wall defining a through-hole, and the magnetic part fixed in the through-hole,
the interlayer base material having a base material thickness defining a depth of the through-hole, and the magnetic part having a magnetic part thickness that is equal to the base material thickness and the depth of the through-hole,
the interlayer base material comprising a hot-melt base material and reinforcing fiber yarn embedded in the hot-melt base material,
the hot-melt base material disposed in contact with the magnetic part along the inner side wall of the through-hole to fix the magnetic part in the through-hole, wherein the magnetic part is fixed in the through-hole and the magnetic interlayer is flattened by applying heat and pressure to the magnetic interlayer to melt the hot-melt base material.
|