CPC B23K 26/103 (2013.01) [B23K 26/0876 (2013.01); B23K 26/20 (2013.01)] | 20 Claims |
1. A laser bonding apparatus, comprising:
a stage configured to receive a substrate;
a laser device over the stage, the laser device configured to irradiate a laser beam onto the substrate;
a first rotation support outside of the stage, the first rotation support configured to drive the laser device to rotate in an azimuthal angle direction; and
a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.
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