US 12,005,520 B2
Laser bonding apparatus and method
Wooram Myung, Suwon-si (KR); Seonyoung Kim, Seoul (KR); Hyesun Yoon, Anyang-si (KR); and Young-Chul Park, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jan. 14, 2021, as Appl. No. 17/148,976.
Claims priority of application No. 10-2020-0064691 (KR), filed on May 29, 2020.
Prior Publication US 2021/0370439 A1, Dec. 2, 2021
Int. Cl. B23K 26/10 (2006.01); B23K 26/08 (2014.01); B23K 26/20 (2014.01)
CPC B23K 26/103 (2013.01) [B23K 26/0876 (2013.01); B23K 26/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laser bonding apparatus, comprising:
a stage configured to receive a substrate;
a laser device over the stage, the laser device configured to irradiate a laser beam onto the substrate;
a first rotation support outside of the stage, the first rotation support configured to drive the laser device to rotate in an azimuthal angle direction; and
a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.