US 12,005,509 B2
Cutting tool
Haruyo Fukui, Osaka (JP); Nozomi Tsukihara, Osaka (JP); Anongsack Paseuth, Osaka (JP); and Toshihiro Tabata, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/039,974
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Oct. 14, 2022, PCT No. PCT/JP2022/038393
§ 371(c)(1), (2) Date Jun. 2, 2023,
.
Prior Publication US 2024/0123513 A1, Apr. 18, 2024
Int. Cl. B23B 27/14 (2006.01); C23C 28/04 (2006.01)
CPC B23B 27/14 (2013.01) [C23C 28/042 (2013.01); C23C 28/044 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A cutting tool comprising a substrate and a coating film disposed on the substrate, wherein
the coating film includes a first layer,
the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked,
the first unit layer is composed of AlaCrl-a-bCebN,
a is 0.400 or more and 0.800 or less,
b is 0.001 or more and 0.100 or less,
the second unit layer is composed of TicSil-cN,
c is 0.200 or more and 0.990 or less, and
in the first unit layer and the second unit layer adjacent to the first unit layer, a ratio λ1/λ2 of a thickness λ1 of the first unit layer to a thickness λ2 of the second unit layer is 1.5 or more and 5.0 or less.