US 12,005,508 B2
Cutting tool
Haruyo Fukui, Osaka (JP); Nozomi Tsukihara, Osaka (JP); Anongsack Paseuth, Osaka (JP); and Toshihiro Tabata, Osaka (JP)
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/033,357
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Sep. 22, 2022, PCT No. PCT/JP2022/035452
§ 371(c)(1), (2) Date Apr. 24, 2023,
.
Prior Publication US 2024/0100603 A1, Mar. 28, 2024
Int. Cl. E21B 10/46 (2006.01); B23B 27/14 (2006.01); E21B 10/56 (2006.01); E21B 10/567 (2006.01)
CPC B23B 27/14 (2013.01) [E21B 10/46 (2013.01); E21B 10/567 (2013.01); E21B 10/5676 (2013.01); B23B 2224/32 (2013.01); B23B 2224/36 (2013.01); B23B 2228/105 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A cutting tool comprising a substrate and a coating film disposed on the substrate, wherein
the coating film includes a first layer,
the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked,
the first unit layer is composed of Ti1-a-bAlaCebN,
a is between greater than or equal to 0.350 and equal to or less than 0.650,
b is between greater than or equal to 0.001 and equal to or less than 0.100,
the second unit layer is composed of TicSi1-cN, and
c is between greater than or equal to 0.20 and equal to or less than 0.99.