US 12,005,482 B2
Substrate treatment device
Kensuke Demura, Yokohama (JP); Daisuke Matsushima, Yokohama (JP); and Masaya Kamiya, Yokohama (JP)
Assigned to SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed by Shibaura Mechatronics Corporation, Yokohama (JP)
Filed on Mar. 9, 2021, as Appl. No. 17/195,924.
Claims priority of application No. 2020-062170 (JP), filed on Mar. 31, 2020; and application No. 2021-001890 (JP), filed on Jan. 8, 2021.
Prior Publication US 2021/0299713 A1, Sep. 30, 2021
Int. Cl. H01L 21/67 (2006.01); B08B 3/10 (2006.01); B08B 7/00 (2006.01)
CPC B08B 7/0092 (2013.01) [B08B 3/10 (2013.01); H01L 21/67051 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A substrate treatment device, comprising:
a placement stand having a plate shape, and being configured to rotate;
a plurality of support portions provided on one surface of the placement stand and supporting a substrate, a planar shape of the substrate being a substantially quadrangle, each of the plurality of support portions supporting a corner part of the substrate;
a liquid supplier configured to supply a liquid onto a surface of the substrate supported by the support portions, the surface of the substrate being a surface opposite to the placement stand side of the substrate, a film of the liquid being formed by the liquid supplied onto the surface of the substrate;
a cooling part configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions, the film of the liquid becoming supercooled by the supplied cooling gas and then freezing;
a protrusion provided on the one surface of the placement stand, the protrusion provided at a position on or near a boundary line of a region where the substrate supported by the plurality of support portions is provided in a plan view, the protrusion extending along the boundary line, the protrusion being not provided at a position of the corner part of the substrate, a gap being configure to be formed between a top portion of the protrusion and the back surface of the substrate; and
a controller controlling the liquid supplier and the cooling part, the controller being configured to perform following steps;
a liquid film forming step of forming a liquid film by supplying the liquid toward the surface of the substrate,
a supercooling step in which the liquid film on the surface of the substrate being supercooled state by the cooling part.