US 12,005,481 B2
Systems for improved efficiency of ball mount cleaning and methods for using the same
Ying-Hao Wang, Tainan (TW); Chien-Lung Chen, Hsinchu (TW); Chia-Han Chuang, Changhua County (TW); Jhe-Hong Wang, Hsinchu (TW); and Chien-Chi Tzeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on Apr. 19, 2022, as Appl. No. 17/723,982.
Prior Publication US 2023/0330710 A1, Oct. 19, 2023
Int. Cl. B08B 3/02 (2006.01); H01L 21/677 (2006.01); B05B 9/03 (2006.01); B05B 13/02 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC B08B 3/022 (2013.01) [H01L 21/67706 (2013.01); B05B 9/035 (2013.01); B05B 13/0221 (2013.01); H01L 23/3675 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of cleaning a semiconductor package assembly, comprising:
moving the semiconductor package assembly along a first direction relative to a sprayer device and a dryer using a conveyor, wherein the sprayer device and the dryer are spatially displaced relative to one another along the first direction such that the semiconductor package assembly moves past the sprayer device before moving past the dryer;
directing a pressurized cleaning fluid toward the semiconductor package assembly to thereby clean the semiconductor package assembly, using the sprayer device, while the semiconductor package assembly moves past the sprayer device; and
directing a pressured gas flow toward the semiconductor package assembly, using the dryer, while the semiconductor package assembly moves past the dryer,
wherein directing the pressurized cleaning fluid toward the semiconductor package assembly further comprises:
generating a plurality of spray distribution patterns by the sprayer device that comprises a plurality of fluidic nozzles that are attached to a fluidic conduit, which comprises a longitudinal axis, such that the plurality of fluidic nozzles forms a linear array of nozzles comprising a uniform spacing between neighboring nozzles along a second direction that is parallel to the longitudinal axis of the fluidic conduit and a non-uniform spacing of the neighboring nozzles along a third direction perpendicular to the second direction, the non-uniform spacing comprising alternating displacements of the neighboring nozzles along the third direction.